Summary of information: In September 2016, a well-known computer OEM factory from China came to our company to discuss how to solve the problem of adhesive for chip and IC packaging
1. Glue requirements: The product is used in the IC chip mounting process, and is required to be suitable for steel screen printing or equipment dispensing, resistant to high and low temperatures, and able to pass through the wave soldering production process
Recommendation for using glue: Brand: Derun Adhesive Model: HJ-1505 Name: SMT Patch Red Adhesive Product features:
Derun electronic red glue is a single component, paste shaped, fast heat hardening, high thixotropy; Has good shear thinning viscosity and low moisture absorption characteristics; Good resistance to high and low temperature impacts, insulation, weather resistance, solder resistance, and other properties

Application industries: medical devices, electronic toys, instruments and meters, intelligent manufacturing, automotive electronics, aerospace

Product applications: B-ultrasound machine, PSP, mechanical dog, infrared instrument, crusher, voice instrument, intelligent robot, fluorescent instrument, satellite phone, song order machine, purifier, monitor, tachometer
2. Adhesive Requirements: The product should be filled with adhesive for computer motherboard CPU chips, with a minimum shrinkage rate and a small expansion coefficient to protect the chips

Recommendation for using glue:
Brand: Derun Adhesive Model: HJ-1601 Name: Bottom filling adhesive

Product features: Bottom filling adhesive is a single component modified epoxy adhesive suitable for bottom filling of chips, BGA, or CSP. It can form a consistent and defect free bottom filling layer, which can effectively reduce the impact caused by the mismatch of the coefficient of thermal expansion of the chip and the substrate or external force, damage to the chip, and improve the reliability of the product.