Summary of information:
Derun has developed a router glue solution through analysis of router glue usage. Develop appropriate solutions for the adhesive requirements of sealing and bonding the base and cover plate, as well as sealing and bonding heat dissipation fins in routers
Analyze and solve with glue
Adhesive for bonding and sealing
Adhesive application area: Seal and bond the base and cover plate
Adhesive requirements: aging resistance, waterproof insulation, high and low temperature resistance, high adhesive strength
Analyze and solve with glue
Adhesive for bonding and sealing

Adhesive application area: Seal and bond the base and cover plate
Adhesive requirements: aging resistance, waterproof insulation, high and low temperature resistance, high adhesive strength
Product Recommendation: HJ-317 Thermal Conductive Silicone
Recommendation reason: 1. Suitable for high-strength bonding between different materials

2. Resistance to high and low temperatures (-50-300) degrees
3. Stable thermal conductivity function